Planar electrical connection (PEC) technology, uses our self-owned conductive layer and conductive adhesive for the cell connection and self-developed insulating encapsulation composite( IEC) material for the insulation of positive and negative electrode, replacing the ribbon connection approach, decreases the possibility of potential micro cracks caused by soldering stress, which is believed to be a major cause of power degradation.

No. 1750 Changzhou South Road, Ma'anshan Economic and Technological Development Zone (Demonstration Park)